AOS-3576DL
产品介绍：
1 规格清单 Specification List
AOS-3576DL的系统功能和接口特性如下表所示。D-3576’s system functions and interface features are shown in the following table.
功能&接口 Function & Interface | 详细描述 Detailed Description |
CPU | RK3576 四核Cortex-A72+四核Cortex-A53，最高主频2.2GHz RK3576 Quad-core Cortex-A72 and Quad-core Cortex-A53, up to 2.2GHz |
DDR | LPDDR5 3GB（4GB|8GB|16GB可选） LPDDR5 3GB (4GB|8GB|16GB optional) |
存储 Storage | 默认标配32GB EMMC NAND芯片，可扩展至最大128GB The default comes with an 32GB EMMC NAND chip that can scale up to 128GB |
LVDS | 30针行业标准双路LVDS接口，支持VESA/JEITA格式，最高支持1080P输出 30-pin industry-standard dual LVDS supporting VESA/JEITA format up to 1080P output |
MIPI-DSI | 31-Pin FPC MIPI-DSI显示接口，最高支持1920x1200输出 31-Pin FPC MIPI-DSI display port supporting up to 1920x1200 |
HDMI输出 HDMI Output | 1路HDMI 2.1标准显示接口，最高支持4K输出（HDMI和EDP复用，二选一） 1 HDMI 2.1 standard display interface supports up to 4K output (HDMI and EDP reuse, a choice) |
HDMI输入 HDMI Input | HDMI 2.0/1.4b标准输入接口，最高支持4K@60Hz HDMI 2.0/1.4b standard video input interface, up to 4K@60Hz |
EDP | 20针行业标准双路EDP接口，支持1~4通道模式，最高支持4K@60Hz输出（EDP和HDMI复用，二选一）20-pin industry-standard EDP supporting 1~4 lanes format up to 4K@60Hz output (EDP and HDMI reuse, a choice) |
耳机/麦克 HP/MIC | 支持美标4段耳麦一体3.5mm插座（左-右-地-麦克） Support CTIA 4-pole HP/MIC socket (Left-Right-GND-Mic) |
线路输出 Line Output | 支持标准左右声道线路输出（排针接口+耳机接口） Support standard left and right channel line output (pin header + headphone jack) |
功放输出 Amplifier output | 8欧·8W双路音频功放输出 8 Ohm 8W Dual Audio Amplifier Output |
MIC输入 MIC Input | 单端MIC输入（排针接口） Single-End MIC input (pin header) |
线路输入 Line Input | 支持标准左右声道线路输入（排针接口） Support standard left and right channel line input (pin header) |
USB接口 USB Interface | 2个横插接口（USB Host 3.0x1和USB OTG 3.0x1），8个内置排针（USB Hub 2.0x6和USB Host 3.0x2） 2 horizontal connectors (USB Host 3.0x1 and USB OTG 3.0x1), 8 pin headers (USB Hub 2.0x6 and USB Host 3.0x2) |
串口 Serial Port | 2个TTL/RS-232/RS-485兼容内置，6个TTL/RS-232兼容内置 2 TTL/RS-232/RS-485 compatible, 6 TTL/RS-232 compatible |
TF卡 Micro SD Card | 自弹式TF卡插座，最高支持256GB TF卡 Self-elastic micro SD card socket, up to 256GB capacity |
MIPI摄像头 MIPI Camera | 支持最高1600万4-Lane MIPI CSI摄像头（选配） Support MIPI CSI camera up to 16 million pixels (optional) |
摄像头 Camera | 支持800万的像素以内USB摄像头 Support USB camera within 8 million pixels |
WIFI | 内置高性能WiFi6模块，支持IEEE 802.11 a/b/g/n/ac/ax，默认2.4G/5G WiFi Built-in high performance WiFi6 module, support IEEE 802.11 a/b/g/n/ac/ax, dual-band is configured by default. |
蓝牙 Bluetooth | 内置高性能BT模块，支持V2.1+EDR/BT v3.0/BT v3.0+HS/BT v4.0/BT v5.0 Built-in high performance BT module with support for V2.1+EDR/BT v3.0/BT v3.0+HS/BT v4.0/BT v5.0 |
以太网口 Ethernet | 2路10/100/1000M自适应以太网RJ45网口+ 4芯POE供电排针 2 port 10/100/1000M Adaptive Ethernet RJ45 connector + 4-Pin POE header |
m-PCIE | 行业标准m-PCIE 4G/5G模块接口+ Micro SIM卡座 Industry standard m-PCIE 4G/5G module interface + Micro SIM Card Socket |
背光控制 Backlight Control | 2路行业标准液晶屏背光控制接口（LVDS和EDP），支持背光开关和亮度调节 2 port Industry standard LCD backlight control header for LVDS & EDP, support for backlight switch and brightness adjustment |
红外遥控 Infrared RC | 标准红外接收排针接口 Standard infrared receiver pin header |
GPIO信号 GPIO Signals | 最高8路GPIO信号，可扩展GPIO按键和/或3.3V输入/输出 Up to 8-way GPIO signals for such as GPIO buttons and/or 3.3V digital input/output |
I2C总线 I2C Bus | I2C排针和FPC接口，可扩展I2C电容屏等 I2C pin header and FPC for I2C capacitive screen and etc |
CAN总线 CAN Bus | 2路CAN排针接口，可扩展CAN总线外设（选配） 2 CAN pin headers for CAN Bus peripherals (optional) |
M.2 PCIE NVME接口 M.2 PCIE NVME Port | 1路M.2 PCIE NVME SSD插座，支持M.2 NVME 2280的固态硬盘 1 Supports M.2 PCIE NVME SSDS, support for M.2 NVME 2280 SSDS |
ADC输入 ADC Input | 1路ADC电压采集信号 1-way ADC voltage acquisition signal |
实时时钟 Real Time Clock | 超低功耗RTC电路（带CR1220纽扣电池），并可支持定时开关机 Ultra-low-power RTC circuit (CR1220 battery) with timer and alarm functionalities |
指示灯 LED Indicator | 红色待机指示和绿色工作指示灯 Red LED indicator for standby and green LED indicator for running |
按键 Buttons | 烧录键（RECOVERY）和电源键 Recovery mode button and power switch button |
电源输入 DC Input | 支持9~15V宽电压直流电源输入 Supports 9~15V wide voltage DC power input |
环境要求 Ambient Requirement | 工作温度-20°C ~ 70°C，工作湿度0%~95%（不结露） Working temperature -20°C ~ 70°C, working humidity 0%~95% (non-condensing) |
物理尺寸 Physical Size | 长*宽*高（135mm*95mm*13mm），PCB正面高度7.5mm Length*Width*Height (135mm*95mm*13mm), PCB top side height 7.5mm |
操作系统 Operating System | 推荐安卓14，选配Linux Buildroot/Debian 12/Ubuntu-22.04（待发布） Recommend android 14, optional Linux Buildroot / Debian 12 /Ubuntu 22.04 (be release) |
物理尺寸
